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Ion etching equipment Detailed ConsultingICP high density plasma etching equipment (fully automatic control / handle 5 inches substrate)
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| Production | ICP high density plasma etching equipment |
|---|---|
| Etching size | 5 inches |
| Substrate refrigeration | Water refrigeration + helium back refrigeration |
| Etching materials | Silicon-based materials and metal |
| Size of Chamber | 225mm×H350mm |
| Vacuum system | 620L/S molecular pump +8L/S dry pump |
| Ultimate vacuum | 5.0×10-4Pa |
| Power system | 13.56MHz、1000W RF powerautomatic matching, automatic control; 13.56MHz、500W RF powerautomatic matching, automatic control |
| Pressure control | MKS pressure control system, the downstream flow control |
| Gas circuit | 6-ways flow controller, full-automatic control, full-automatic and record flow parameters |
| Control system | Integrated industrial controllers |
| System software | ICP custom control software |
| Alarm and protection | It alarms in time and executes appropriate protection measures when abnormal situations, such as water shortage, over-current, over-voltage and open circuit, happen on electrodes. |
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